Author:Sophie
Electronic products function depends on the correct interconnected electronic components, most of these components are interconnected based on the circuit board welding. Circuit board welding in the assembly of electronic products, has been playing an important role. There are many connections even if the current technology, but the circuit board welding remained dominant.
Circuit board welding is an important part of electronic technology. Proper design and good solder process (ie, circuit board soldering process), is the key factor for reliable soldering. The so-called "reliable" refers to all the properties of the solder joints only when the product has just produced as required, but also throughout the life of electronic products, and should be guaranteed to work correctly.
Although all of the physical-chemical principles of welding process is the same, but for soldering electronic circuits and has its own characteristics, i.e., miniaturization and high reliability, which is consistent with the characteristics of electronic products. Circuit board welding quality will be affected by many factors. Funds such as the type of material and its surface is, the type and thickness of the coating, processing technology and methods, surface condition before welding, soldering components, welding, soldering temperature and time are base metal welding gap size, flux type and performance, welding tools. Important reason for not being among the internal structure of the metal oxides and lead solder components lead compounds the situation is affecting the surface leads solderable, but also affect the surface of the oxide Flexible pcb pad solderability main reason.
Using tin-lead soldering tin-lead solder is called, referred to soldering, the mechanism is: will solder in the solder process, weldment and copper under the action of heat welding, weldments and copper does not melt, the solder is melted and welded surface wetting rely weldments asked two copper atoms and molecules to move, thereby causing diffusion between the metal and the weld is formed between the copper alloy layer of a metal member, and to connect the copper foil and the weldment together, they get solid and reliable solder joints, the above process is the role of the physical-chemical processes each other.
When the solder and welding weldment joint is heated to welding temperature, melting the solder does not melt weldment. Forming welding solder wetting rely molten state welding surface, resulting in the metallurgical, chemical reaction to form a bonding layer, to achieve a combination of the weldment. Lead-tin solder melting point below 200 ℃, suitable for connecting semiconductors and other electronic materials. Simply heating tools and materials can be processed, less investment. Joints have sufficient strength and electrical properties. Soldering process reversible, easy desoldering
Sophie Deng
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