WonderfuI Printed Circuit Board

From the number of layers and the development direction of PCB board to points, the PCB industry into a single panel, double panel, conventional multilayer flexible board, HDI (high density interconnect) board, package substrate and other six major product segments . From the product life cycle "lead-in period - growing - maturity - a recession" and four-cycle dimension view, where a single panel, double panel electronics products because they do not fit the current trends in the application of thin short, is in recession, its value gradually reduce the proportion of developed countries and regions such as Japan, Korea and Taiwan has been very little in the local production of such products, many manufacturers have made it clear that no longer meet single and double panel. Conventional multilayer and HDI products, process capability maturity are more sophisticated, higher value-added products, is currently the most major PCB factory full Zhugong direction, Chinese manufacturers are only a handful of ultrasound and electronic production techniques; scratch plates, especially high-density flexible and rigid PCB board, due to the current technology is not yet mature, a lot of manufacturers failed to achieve mass production of products are growing, but because it has more than a rigid plate adapted to digital products features flexible plate growth is high, is the future direction of the various manufacturers.
     
IC package substrate used, whether it is R & D or manufacturing in the electronics industry in developed countries such as Japan, South Korea, more mature, but in the country is still in the exploratory stage technology, only Ibiden (Beijing) Co., Ltd., Advanced Semiconductor (Shanghai) Co., Ltd., Zhuhai Doumen Chao Yi Electronics Co., Ltd., one of the few manufacturers in small batches. This is because of China's IC industry is still underdeveloped, but with the multinational electronics giant will continue to move to China IC R & D institutions, and improve China's own R & D and production levels of IC package substrate will have a huge market, is a big vision plant development. China's hard board (single-sided, double-sided, multilayer, HDI board) share reached 70%, of which 5 percent share of the plywood accounted for the largest proportion, followed by soft board with 15.6% of the proportion of second place. Due to the pressure of oversupply, most manufacturers to enter the price war, output growth is lower than expected.      
        
PCB domestic product from the future development trend, output growth is slightly lower than the sales growth was mainly the product gradually to the multilayer structure, the development of high precision. Our multilayer and HDI board is in the business of growing, expanding, increasingly mature technology. MLB is still the mainstream market development; and HDI board by the downstream electronic information products upgrading demand-pull, is in a period of rapid development.

Sophie Deng
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Wonderful PCB Limited
NO.32A,Building NO.1, XianDaiC hengHuaTing,ChuangYeRoad|NanShan District,ShenZhen City 518054|  China  T +86-755-86229518-806 | F  +86 755 2607 3529|  e  wonderful08@wonderfulpcb.com |
w  www.wonderfulpcb.com  | Skype:wonderful-07   |                                                   
Welcome to our trading shows:
1.Booth: L32,Expo Electronic 2013,Apr.10-12th in CROCUS EXPO,Moscow,Russia
2.Booth: 11J36, HK Global sources  Apr.12-15th, 2013 Asia World-Expo, Hong Kong
3.Booth: 9J35, HK Global sources Oct.12-15th,2013 Asia World-Expo, Hong Kong
4.Booth: 70206, CES  2014  Jan,8th-11th in Las Vegas, USA